Packaging of Microwave Integrated Circuits in LTCC Technology / Mise en boitier de circuits intégrés micro-ondes en technologie LTCC
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APA-like:
Tác giả chưa xác định. Packaging of Microwave Integrated Circuits in LTCC Technology / Mise en boitier de circuits intégrés micro-ondes en technologie LTCC. Thesis, HAL - Pháp.
Việt Nam (chuẩn TCVN 5453:1991):
. Packaging of Microwave Integrated Circuits in LTCC Technology / Mise en boitier de circuits intégrés micro-ondes en technologie LTCC. Thesis. HAL - Pháp. Truy cập từ .
Tóm tắt
This thesis concerns the introduction and development in our laboratory of a multilayer ceramic technology, called LTCC, for RF and microwave packaging. LTCC stands for Low Temperature Co-fired Ceramics. As can be understood from its name, the low temperature means that the LTCC circuit is fired below 1000 °C that allows the use of high conductivity materials such as gold and silver. The thesis work starts after the bibliographic study of RF packaging technology, with the choice of LTCC substrat...